Publications

Book Chapters:

  1. A. Elfadel, D. Bonning and X. Li (Editors), Machine Learning in VLSI Computer-Aided Design, Springer, 2018 (N. Kupp, K. Huang, A. Ahmadi, C. Xanthopoulos, and Y. Makris, “Gaussian Process-Based Wafer-Level Correlation Modeling and its Applications”).

  2. T. Hokimoto (Editors), Advances in Statistical Methodologies and Their Application to Real Problems, InTech, 2017 (M. Agrawal, S. Vidyashankar, and K. Huang, “On Decoding Brain Electrocorticography Data for Volitional Movement Intention Prediction: Theory and On-Chip Implementation”).

Peer-Reviewed Journal Papers:

  1. X. Zhang, M. Samragh, S. Hussain, K. Huang, and F. Koushanfar, “Scalable binary neural network applications in oblivious inference,” ACM Transactions on Embedded Computing Systems. (in press)

  2. K. Huang, Y. Liu, N. Korolija, J. Carulli, and Y. Makris, “Statistical methods for detecting recycled electronics: from ICs to PCBs and beyond,” IEEE Design & Test. (in press)

  3. H. Chen, X. Zhang, K. Huang, and F. Koushanfar, “AdaTest: reinforcement learning and adaptive sampling for on-chip hardware Trojan detection,” ACM Transactions on Embedded Computing Systems, vol. 22, no. 2, pp. 1-23, 2023.

  4. D. Ma, X. Zhang, K. Huang, Y. Jiang, W. Chang, and X. Jiao, “DEVoT: dynamic delay modeling of functional units under voltage and temperature variations,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 4, pp. 827-839, 2022.

  5. X. Yang, K. Huang, Z. Zhang, Z. Zhang, and F. Lin, “Eco-driving system for connected automated vehicles: multi-objective trajectory optimization,” IEEE Transactions on Intelligent Transportation Systems (TITS), vol. 22, no. 12, pp. 7837-7849, 2021.

  6. K. Huang, X. Zhang, and N. Karimi, “Real-time prediction for IC aging based on machine learning,” IEEE Transactions on Instrumentation and Measurement (TIM), vol. 68, no. 12, pp. 4756-4764, 2019.

  7. P. Kansara, S. Reddy, L. Abdallah, and K. Huang, “Dynamic analog/RF alternate test strategies based on on-chip learning,” Journal of Electronic Testing: Theory & Applications (JETTA), Springer, vol. 34, no. 3, pp. 337-349, 2018.

  8. K. Huang, X. Yang, Y. Lu, C. Mi, and P. Kondlapudi, “Ecological driving system for connected/automated vehicle using a two-stage control hierarchy,” IEEE Transactions on Intelligent Transportation Systems (TITS), vol. 19, no. 7, pp. 2373-2384, 2018.

  9. A. Ahmadi, H.-G. Stratigopoulos, K. Huang, A. Nahar, B. Orr, M. Pas, J. M Carulli, and Y. Makris, “Yield forecasting across semiconductor fabrication plants and design generations,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 36, no. 12, pp. 2120-2133, 2017.

  10. K. Huang, J. Wen, and J. Willmore, “Test suite-based analog/RF test time reduction using canonical correlation,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 35, no. 12, pp. 2143-2147, 2016.

  11. K. Huang, Y. Liu, N. Korolija, J. Carulli, and Y. Makris, “Recycled IC detection based on statistical methods,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 34, no. 6, pp. 947-960, 2015.

  12. K. Huang, N. Kupp, C. Xanthopoulos, J. Carulli, and Y. Makris, “Low-cost analog/RF IC testing through combined intra- and inter-die correlation models,” IEEE Design & Test, vol. 32, no. 1, pp. 53-60, 2015.

  13. U. Guin, K. Huang, D. DiMase, J. Carulli, M. Tehranipoor, and Y. Makris, “Counterfeit integrated circuits: a rising threat in the global semiconductor supply chain,” Proceedings of the IEEE, vol. 102, no. 8, pp. 1207-1228, 2014.

  14. K. Huang, H.-G. Stratigopoulos, S. Mir, C. Hora, Y. Xing, and B. Kruseman, “Diagnosis of local spot defects in analog circuits,” IEEE Transactions on Instrumentation and Measurement (TIM), vol. 61, no. 10, pp. 2701-2712, 2012.

Peer-Reviewed Conference Papers:

  1. Z. Ghodsi, M. Javaheripi, N. Sheybani, X. Zhang, K. Huang, and F. Koushanfar, “zPROBE: zero peek robustness checks for federated learning,” in Proc. of IEEE/CVF International Conference on Computer Vision (ICCV), 2023, pp. 4860-4870.

  2. K. Huang, and L. Abdallah, “Analog/RF circuit aging prediction based on on-chip machine learning,” in Proc. of International Conference on Artificial Intelligence and Big Data (ICAIBD), 2023, pp. 294-298.

  3. K. Huang, Md T. H. Anik, X. Zhang, and N. Karimi, “Real-time IC aging prediction via on-chip sensors,” in Proc. of IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 2021, pp. 1-6.

  4. M. Samragh, S. Hussain, X. Zhang, K. Huang, and F. Koushanfar, “On the application of binary neural networks in oblivious inference,” in Proc. of CVPR 1st Workshop on Binary Networks for Computer Vision, 2021, pp. 1-10.

  5. F. Lin, A. Ahmadi, K. Sekar, Y Pan, and K. Huang, “IC layout weak point quality evaluation based on statistical methods,” in Proc. of IEEE VLSI Test Symposium (VTS), San Francisco, CA, USA, 2018, pp. 1-6.

  6. X.Yang, K. Huang, W. Hao, and Y. Lu, “Development of two-stage-based eco-driving system for connected automated vehicles,” in Proc. of 97th Transportation Research Board (TRB) Annual Meeting, Washington D. C., USA, 2018, Paper 18-00772.

  7. N. Karimi and K. Huang, “Prognosis of NBTI aging using a machine learning scheme,” in Proc. of IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT), Storrs, CT, USA, 2016, pp. 1-4.

  8. M. Agrawal, S. Vidyashankar, and K. Huang, “On-chip implementation of ECoG signal data decoding in brain-computer interface,” in Proc. of International Mixed-Signal Testing Workshop (IMSTW), Sant Feliu de Guixols, Spain, 2016, pp. 1-6.

  9. Y. Lu, K. Subramani, H. Huang, N. Kupp, K. Huang, and Y. Makris, “A Comparative study of one-shot statistical calibration methods for Analog/RF ICs,” in Proc. of IEEE International Test Conference (ITC), Anaheim, CA, USA, 2015, Paper 21.3.

  10. Y. Liu, G. Volanis, K. Huang, and Y. Makris, “Concurrent hardware Trojan detection in wireless cryptographic ICs,” in Proc. of IEEE International Test Conference (ITC), Anaheim, CA, USA, 2015, Paper 4.1.

  11. A. Ahmadi, K. Huang, A. Nahar, B. Orr, M. Pas, J. Carulli, and Y. Makris, “Yield prognosis for fab-to-fab product migration,” in Proc. of IEEE VLSI Test Symposium (VTS), Napa, CA, USA, 2015, pp. 1-6. (Best paper award)

  12. C. Xanthopoulos, K. Huang, A. Poonawala, A. Nahar, B. Orr, J. Carulli, and Y. Makris, “IC laser trimming speed-up through wafer-level spatial correlation modeling,” in Proc. of IEEE International Test Conference (ITC), Seattle, WA, USA, 2014, Paper 19.2. (Acceptance rate 25%)

  13. A. Ahmadi, K. Huang, S. Natarajan, J. Carulli, and Y. Makris, “Spatio-temporal wafer-level correlation modeling with progressive sampling: a pathway to HVM yield estimation,” in Proc. of IEEE International Test Conference (ITC), Seattle, WA, USA, 2014, Paper 18.1. (Acceptance rate 25%)

  14. Y. Liu, K. Huang, and Y. Makris, “Hardware Trojan detection through golden chip-free statistical side channel fingerprinting,” in Proc. of Design Automation Conference (DAC), San Francisco, CA, USA, June 2014, pp. 1-6. (Acceptance rate 23%)

  15. K. Huang, J. Carulli, and Y. Makris, “Counterfeit electronics: a rising threat in the semiconductor manufacturing industry,” in Proc. of IEEE International Test Conference (ITC), Anaheim, CA, USA, September 2013, Paper L3.4. (Acceptance rate 30%)

  16. K. Huang, H.-G. Stratigopoulos, and S. Mir, “Fault modeling and diagnosis for nanometric analog/mixed-signal/RF circuits,” in Proc. of IEEE International Test Conference (ITC), Anaheim, CA, USA, September 2013, Paper PTF3. (Acceptance rate 30%)

  17. K. Huang, N. Kupp, J. Carulli, and Y. Makris, “Process monitoring through wafer-level spatial variation decomposition,” in Proc. of IEEE International Test Conference (ITC), Anaheim, CA, USA, September 2013, Paper 5.3. (Acceptance rate 30%)

  18. O. Sinanoglu, N. Karimi, J. Rajendran, R. Karri, Y. Jin, K. Huang, and Y. Makris, “Reconciling the IC test and security dichotomy,” in Proc. of IEEE European Test Symposium (ETS), Avignon, France, May 2013, pp. 1-6. (Acceptance rate 30%)

  19. K. Huang, N. Kupp, J. Carulli, and Y. Makris, “On combining alternate test with spatial correlation modeling in analog/RF ICs,” in Proc. of IEEE European Test Symposium (ETS), Avignon, France, May 2013, pp. 1-6. (Acceptance rate 30%)

  20. K. Huang, H.-G. Stratigopoulos, L. Abdallah, S. Mir, and A. Bounceur, “Multivariate statistical techniques for analog parametric test metrics estimation,” in Proc. of IEEE International Conference on Design and Technology of Integrated Systems in Nanoscale Era (DTIS), Abu Dhabi, UAE, March 2013, pp. 6-11.

  21. K. Huang, N. Kupp, J. Carulli, and Y. Makris, “Handling discontinuous effects in modeling spatial correlation of wafer-level analog/RF tests,” in Proc. of Design, Automation and Test in Europe conference (DATE), Grenoble, France, March 2013, pp. 553-558. (Best paper award) (Acceptance rate 24.8%)

  22. K. Beznia, A. Bounceur, L. Abdallah, K. Huang, S. Mir, and R. Euler, “Accurate estimation of analog test metrics with extreme circuits,” in Proc. of IEEE International Conference on Electronics, Circuits and Systems (ICECS), Seville, Spain, December 2012, pp. 272-275.

  23. N. Kupp, K. Huang, J. Carulli, and Y. Makris,“Spatial estimation of wafer measurement parameters using Gaussian process models,” in Proc. of IEEE International Test Conference (ITC), Anaheim, CA, USA, November 2012, pp. 1-8. (Acceptance rate 30%)

  24. N. Kupp, K. Huang, J. Carulli, and Y. Makris, “Spatial correlation modeling for probe test cost reduction,” in Proc. of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, CA, USA, November 2012, pp. 23-29. (Acceptance rate 24.3%)

  25. K. Huang, J. Carulli, and Y. Makris, “Parametric counterfeit IC detection via support vector machines,” in Proc. of IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT), Austin, TX, USA, October 2012, pp. 7-12.

  26. K. Huang, H.-G. Stratigopoulos, and S. Mir, “Bayesian fault diagnosis of RF circuits using nonparametric density estimation,” in Proc. of IEEE Asian Test Symposium (ATS), Shanghai, China, December 2010, pp. 295-298.

  27. K. Huang, H.-G. Stratigopoulos, and S. Mir, “Fault diagnosis of analog circuits based on machine learning,” in Proc. of Design, Automation and Test in Europe conference (DATE), Dresden, Germany, March 2010, pp. 1761-1766. (Acceptance rate 24.8%)

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